Abstract
This paper presents an original methodology and a test bench for active power cycling and on-line junction temperature measurement during power cycling of power devices embedded in PCB. This method is based on the use of the ratio between forward voltage and forward current variations (∆VF,∆IF) during conduction period to estimate the thermal voltage UT and thus the junction temperature in real time. The objective of this study is to estimate the junction temperature even for high frequency of power cycling tests. First, the measurement method is presented, and then the test bench is described.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
