Abstract
Practical silicon photonic interconnects become possible nowadays after the realization of the practical silicon light sources, where the hybrid integrations of III–V semiconductors and silicon by bonding play a fundamental role. Photonic interconnects dissipate substantially less power and offer a significantly greater information bandwidth than those of electronic interconnects; however, one emerging problem is the size mismatch between photonic and electronic components when integrated on a chip. Therefore, surface plasmonic source with deeply sub-wavelength size is under intense investigation as the next generation Si-based light source for on-chip interconnects. In this paper, we shall review some of the latest achievements on this topic.
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