Abstract

In this work, a miniaturized bandpass filter (BPF) constructed of two spiral intertwined inductors and a central capacitor, with several interdigital structures, was designed and fabricated using integrated passive device (IPD) technology on a GaAs wafer. Five air-bridge structures were introduced to enhance the mutual inductive effect and form the differential geometry of the outer inductors. In addition, the design of the differential inductor combined with the centrally embedded capacitor results in a compact construction with the overall size of 0.037λ0 × 0.019λ0 (1537.7 × 800 μm2) where λ0 is the wavelength of the central frequency. For the accuracy evolution of the equivalent circuit, the frequency-dependent lumped elements of the proposed BPF was analyzed and modeled through the segment method, mutual inductance approach, and simulated scattering parameters (S-parameters). Afterward, the BPF was fabricated using GaAs-based IPD technology and a 16-step manufacture flow was accounted for in detail. Finally, the fabricated BPF was wire-bonded with Au wires and packaged onto a printed circuit board for radio-frequency performance measurements. The measured results indicate that the implemented BPF possesses a center frequency operating at 2 GHz with the insertion losses of 0.38 dB and the return losses of 40 dB, respectively, and an ultrawide passband was achieved with a 3-dB fraction bandwidth of 72.53%, as well. In addition, a transmission zero is located at 5.32 GHz. Moreover, the variation of the resonant frequency with different inductor turns and metal thicknesses was analyzed through the simulation results, demonstrating good controllability of the proposed BPF.

Highlights

  • With the rapid development of modern intelligence, communication and telecommunication modules are widely applied to all parts of daily life, known as “connecting everything”

  • The bandpass filter (BPF) constructed using passive components are generally accompanied by drawbacks in the form of electromagnetic interference and eddy currents [13]. Considering these issues, GaAs-based integrated passive device (IPD) technology is fairly attractive for high-performance BPF implementation, as a result of the advantages of high integration, effective cost, and full compatibility [14,15]

  • CFbandwidth and transmission zero (TZ) is an evaluating a evaluation of a BPF, and the controllability of the is an additional factor in evaluating a BPF device

Read more

Summary

Introduction

With the rapid development of modern intelligence, communication and telecommunication modules are widely applied to all parts of daily life, known as “connecting everything”. Low-temperature co-fired ceramic (LTCC) technology, using the strip lines resonator and the hybrid resonant circuit, is a good candidate for implementing a compact BPF, as a result of its multilayer capability and integrated packing capability Such modules possess a low unloaded quality factor (Q-factor), which can be attributed to the poor roll-off and relatively high insertion losses. The BPFs constructed using passive components are generally accompanied by drawbacks in the form of electromagnetic interference and eddy currents [13] Considering these issues, GaAs-based integrated passive device (IPD) technology is fairly attractive for high-performance BPF implementation, as a result of the advantages of high integration, effective cost, and full compatibility [14,15]. It was measured with an insertion loss of 0.38 dB at the CF and 35.15 dB at the TZ, a return loss of 40 dB at the CF, and the 3-dB fraction bandwidth (FBW) of 72.53% after bonding with Au wires and packaged onto a printed circuit board (PCB)

Design
Design System
Dimensional
Model Inside the Segment Box
Models Outside the Segment Box
Embedded Capacitor
Parasitic Effects Associated with the Substrate
IPD Fabrication Process
Effects of Variable Dimension Parameters
Results
Conclusions
Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call