Abstract
Investigations of the new metal scheme for ohmic contact to p-GaN have been carried out. The specific contact resistance was measured to be ρc=3.6×10-3 Ω cm2 which is the lowest value ever reported for moderately doped p-GaN (4.4×1017/cm3). All metals were deposited on metalorganic chemical vapour deposition (MOCVD) grown p-GaN. The interaction mechanism between Ni and p-GaN has been investigated. Zn diffusion has been observed during annealing in Au–Zn/Ni on p-GaN. The interfacial reaction mechanism during annealing has been studied by secondary ion mass spectroscopy (SIMS) measurement. From this measurement, it is observed that Ni dissociates at the p-GaN surface and this dissociation promotes the Zn diffusion upon heat treatment. The electrical properties were studied using current–voltage (I–V) measurements at room temperature. The microstructure between the Ni and p-GaN interface was investigated using high-resolution transmission electron microscopy (TEM) before and after the heat treatment.
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