Abstract
The relationship between the instantaneous generation of flaked particles and micro-arc discharge is investigated in mass-production plasma etching equipment. To investigate the mechanism of such particle generation, we simultaneously detect particle generation from deposited films on a ground electrode and occurrence of micro-arc discharge under mass-production conditions. The results indicate that the deposited films are severely damaged and flake off as numerous particles when micro-arc discharge occurs. The rapid changes in floating potential on the films due to micro-arc discharge cause electric field stress, which works as an impulsive force. The particles are generated not from the melting of chamber parts by micro-arc discharge but from the flaking of deposited films by electric field stress acting as an impulsive force.
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