Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array

Byungjin Bae,Ki Jin Han,Jingook Kim

doi:10.1109/access.2020.3003231

Byungjin Bae, Ki Jin Han + Show 1 more

Open Access

https://doi.org/10.1109/access.2020.3003231

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Abstract

For the accurate and reliable multi-port characterization of vertical interconnection array structures, this paper presents an indirect-contact probing method to obtain network parameters of N-port device-under-tests (DUTs) using an M-port (N > M) vector network analyzer (VNA) with a dielectric contactor. By utilizing the dielectric contactor as auxiliary loads for un-probed ports for vertical interconnections, multiple M-port sub-array network parameters can be correctly synthesized into the N-port network parameters through the renormalization processes. To verify the proposed method, four-port DUTs for packaging and microwave applications were characterized with two-port indirect-contact probing sub-array simulations including the dielectric contactor. Compared with two-port direct-contact probing simulations without the dielectric contactor, it was confirmed that the proposed method with the dielectric contactor provides improved accuracy in terms of the feature selective validation (FSV) method.

Highlights

In the design of high density packages for upcoming applications such as artificial intelligence (AI) hardware [1]–[3], an essential task is the measurement of a multitude of interconnections
From the numerical characterizations of three device under test (DUT) examples containing four vias, the proposed method exhibits improved accuracy based on the feature selective validation (FSV) method, compared to the simple direct-contact probing method without renormalization
For precise and reliable characterization of multiple vertical interconnections with a vector network analyzer (VNA) having a limited number of ports, this paper proposed an indirect-contact probing measurement procedure using a dielectric contactor

Summary

INTRODUCTION

In the design of high density packages for upcoming applications such as artificial intelligence (AI) hardware [1]–[3], an essential task is the measurement of a multitude of interconnections. Port connectors or probes should access all different partial sets of interconnections (or sub-arrays) with the other un-probed ones terminated to auxiliary loads [4], for which we can utilize passives like probing pads when measuring planar structures [5]. Terminating to external loads by soldering or adding connectors is not possible during successive sub-array measurements. Another difficulty in the characterization of the multi-port vertical interconnections is possible damages by the repeated contacts of many probing tips. From the numerical characterizations of three DUT examples containing four vias, the proposed method exhibits improved accuracy based on the feature selective validation (FSV) method, compared to the simple direct-contact probing method without renormalization

CHARACTERIZATION OF DIELECTRIC CONTACTOR AND EXTRACTION OF AUXILIARY LOADS

VERIFICATION OF THE PROPOSED METHOD

Findings

CONCLUSION