Numerical Technique for Resolving the Dual Phase Lag Heat Conduction in Thin Film Metal

Abstract

In this article, a three-time level finite difference scheme is used to resolve the dual phase lag’s (DPL) heat conduction in a micro scale gold film subjected to spontaneous temperature boundary conditions without knowing the heat flux. Finite difference analog of DPL equation on applying to the intermediate grid points of the computational domain results into a system of linear, algebraic equations which can be solved using Thomas’ algorithm to finally obtain the transient temperature solution distributions in the film. The solution predicted by the DPL model is compared with that obtained by the single-phase Cattaneo–Vernotte’s model. Further, the way in which non-Fourier’s temperature distributions affected by the diffusion due to the increase in Heat Conduction Model numbers agree with the predecessor’s published results. The results by both the models revealed a finite thermal wave speed in the film contrasting the infinite speed of heat propagation as stated by the classical Fourier’s thermal model. Low spatial step and higher order finite difference schemes are recommended for better accurate numerical results of the non-Fourier’s temperature distributions occurring in the very short transient period between the instants of the suddenly applied spatial temperature gradient and the reaching of the steady state conditions.