Abstract
Thermal self-compressing bonding (TSCB) is a new solid-state bonding method pioneered by the authors. With electron beam as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of TSCB. However, the thermal stress–strain process during bonding, which is of very important significance in revealing the mechanism of TSCB, was not analysed. In this paper, finite element analysis method is adopted to numerically study the thermal elasto-plastic stress–strain cycle of thermal self-compressing bonding. It is found that due to the localized heating, a non-uniform temperature distribution is formed during bonding, with the highest temperature existed on the bond interface. The expansion of high temperature materials adjacent to the bond interface are restrained by surrounding cool materials and rigid restraints, and thus an internal elasto-plastic stress–strain field is developed by itself which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints. Due to the relatively large plastic deformation, rigid restraint TSCB obtains sound joints in relatively short time compared to diffusion bonding.
Highlights
With the rapid development of aviation industry, the requirements of excellent performance, long life and high reliability for both civil and military aircraft become increasingly strict [1, 2]
With electron beam (EB) as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of rigid restraint Thermal self-compressing bonding (TSCB) [19]
A three-dimensional model based on ABAQUS finite element analysis software was built to analyse the thermal stress–strain process during rigid restraint TSCB of Ti6Al4V titanium alloys
Summary
With the rapid development of aviation industry, the requirements of excellent performance, long life and high reliability for both civil and military aircraft become increasingly strict [1, 2]. Solid-state welding method, especially diffusion welding, can be used to join dissimilar and refractory materials that cannot be welded by fusion welding process [17, 18]. In view of the benefits of solid-state welding, a new solid-state bonding method named as rigid restraint thermal self-compressing bonding (TSCB) is pioneered by the authors, which utilizes locally non-melted heating by centralized heat source to produce solid-state joints. Under the locally non-melted heating, a thermal compressive effect is expected to be developed and a compressive pressure F will be produced synchronously, which facilitates the atom diffusion between butt-weld specimens to produce permanent solid-state joints [19]. With EB as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of rigid restraint TSCB [19]. The bonding mechanism and characteristics of rigid restraint TSCB were investigated
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