Abstract
Abstract Advanced thermal interface materials (TIMs) are indispensable for work reliability and lifespan assurance of high-power density electronic systems by facilitating timely and effective heat dissipation. A random algorithm consisting of diluting, dropping, and stirring processes is first proposed to simulate microstructures of TIMs with continuous particle size distribution, with an accessible maximum volume fraction of 55 vol%. Then the size polydispersity impact on the thermal performance and the fluidity of TIMs is numerically investigated. Simulation results reveal that as the particle size polydispersity increases, the thermal conductivity of TIMs improves, along with the improved fluidity. Therefore, it is necessary to consider the polydispersive impact of filler size distribution in actual production and optimize the material preparation process based on the actual distribution of particles. This work provides a deeper understanding of the influence of particle polydispersity on the co-optimization of the desired attributes of TIMs.
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