Abstract
Traditional heat dissipation materials can no longer withstand the overheating phenomenon caused by excessive heat flux, metal foam materials provide new solutions for chip heat dissipation and air conditioning due to the superior structural characteristics. In this paper, the tetradecahedron model of the foamed copper was constructed to simulate the heat transfer characteristics of the filled foamed copper channel in the boiling flow process to explore the influence of the foamed copper structure parameters and filling length on the heat transfer characteristics. By changing the filling length of the foamed copper, the polynomial fitting function is solved to the optimum filling ratio of 0.6, and the gas phase rate and the working fluid outlet temperature are both at the optimum value ; Introducing the heat transfer influence factor i, it is obtained that it increases with the increase of PPI and decreases with the increase of ε.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Earth and Environmental Science
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
