Abstract
ABSTRACTIn the present work, a novel electroplating cell with both jet array and crossflow induced by the small holes on the side walls is proposed. The flow pattern and hydrodynamic performance are numerically investigated using computational fluid dynamic simulations. The mathematic model of the hydrodynamic properties is presented. The effect of the crossflow and anode/jet-wafer separation distance on the flow pattern and hydrodynamic performance are carefully examined. The results indicate that the electroplating cell with strong crossflow and very short anode/jet-wafer separation distance would have a better hydrodynamic performance.
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