Abstract
In this study impingement air cooling mode of forced convection is adopted for heat dissipation from high power electronic devices in associated with a parallel fin heat sink. Components of airflow velocity in the channel of the extended surfaces are discussed. Pressure drop and other thermal performances are analyzed numerically by a C++ developed code. Thermal and hydraulic characteriza tion of heat sink under cooling condition of air-forced con vection is studied. The hydraulic parameters including ve locity profiles, distribution of static pressure and pressure drop through the heat sink are analyzed and presented schematically. Furthermore, the thermal characteristic of the aluminum approach of cooling is studied by utilizing the contours of the three dimensional temperature distribu tions through the fins, base heat sink and the heat sink body. The performance of the proposed model com puted by the numerical calculation is high compared to current heat sinks as expected of the previous studies.http://dx.doi.org/10.5755/j01.mech.17.2.331
Highlights
As electronic equipment becomes smaller and more advanced, it necessitates higher circuit integration per unit area, which in turn contributes to a rapid increase of heat generation [1].the effective removal of heat dissipations and the maintaining the chip at a safe operating temperature have played an important role in ensuring a reliable operation of electronic components [1]
A low pressure drop is located at the exit channel where velocity is the highest
The numerical results (Figs. 4 and 5) turn out that the pressure drops lie in the range of 5-62 Pa which is not so large
Summary
As electronic equipment becomes smaller and more advanced, it necessitates higher circuit integration per unit area, which in turn contributes to a rapid increase of heat generation [1].the effective removal of heat dissipations and the maintaining the chip at a safe operating temperature have played an important role in ensuring a reliable operation of electronic components [1]. There are many methods in electronics cooling, such as jet impingement cooling and heat pipe [2]. Conventional cooling electronics normally used impinging jet with heat sink showing superiority in terms of unit price, weight and reliability. The most common way to enhance the air-cooling is through the utilization of impingement air jet on a mini or microchannel heat sink. In order to design an effective heat sink, some criterions such as thermal resistance, a low pressure drop and a simple structure should be considered. A thermal design and evaluation method for heat sink is presented. The thermal hydraulic performances of the proposed heat sink are examined numerically using the finite differences method. In order to obtain generalized performance indicators that can be used to analyze plate-fin heat sink performances
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