Abstract
Thermal management of microelectronic devices has become increasingly important to maintain their performance and prolonging the lifespan of the devices. In this study, numerical simulation has been conducted to investigate the heat propagation for high performance microelectronic device of laptop. Two models are constructed and Ansys Fluent is used for the Computational Fluid Dynamics (CFD) simulation, source term is applied at the heat source, heat sink and two different material heat pipes are the main cooling components in the system. The results show that the improved design model is a better design for laptop cooling systems, and the increasing number of air vents, thermal conductivity, and length of heat pipes can effectively cool the high-powered microchip effectively. Transient simulation, considering the wick structure and working fluid in the simulation, is suggested for future work.
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