Abstract
This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.
Highlights
With the rapid development of microelectronic devices, the local heat flux inside has so far increased to more than 300 W/cm2 [1], which is far beyond the heat dissipation limit of air cooling schemes
A much more uniform wall temperature distribution in the double layer layout of microchannels helps to reduce thermal stresses caused by the temperature difference and facilitates improvement of the reliability of microelectronic devices
For the DL-MCHS sample with triangular shape (DL-TRI), the wall temperature first increased along thethe axial in both the upstream region, the the wall temperature distributions along axialflow flowlength length for the upper layer andreached lower layer maximum wall temperature in the It middle downstream region of the channels, and tended of the DL-TRI
Summary
With the rapid development of microelectronic devices, the local heat flux inside has so far increased to more than 300 W/cm2 [1], which is far beyond the heat dissipation limit of air cooling schemes. Microchannel heat sinks, which were proposed by Tuckerman and Pease [2] in 1981, have been recognized to be an efficient means to dissipate high heat flux. Due to its high surface area to volume ratio, large heat transfer coefficient, and small coolant inventory, the microchannel heat sink has been used in recent years as a high-performance compact cooling method in thermal dissipation applications of very-large-scale integrated (VLSI) circuits, microelectromechanical systems, and high power laser diode arrays [3,4,5]. Coolant temperature increases along the stream-wise direction and results in a poor heat exchange process between the coolant and microchannel wall.
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