Numerical Solution of Thermal Residual Stress Analysis with Finite Difference Method of Functionally Graded Circular Plates

Abstract

In this study, thermal residual stress analysis of functionally graded circular plates (FGCP) carried out. Finite difference equations are used in solving Navier's equations of elasticity and Fourier's heat conduction equation. The grading along the plate was made along the surface of plate and it was assumed that the material properties changed according to the Mori-Tanaka approach. Grading along the plate was made in both radial and tangential directions. In this study, the effect of the coordinate derivatives of material properties was taken into consideration in both Fourier's heat conduction equation and Navier's equations of elasticity, unlike the other studies. As a result, when the materials compositions of FGCP were changed from ceramic-rich to metal-rich compositions, the stress levels were not affected considerably. The strain levels increased significantly when the metal compound in the material composition of FGCP was increased. FGCP are emphasized that the change of material properties due to two-dimensional significantly affect distributions of thermal strain and stress. In this study, it was emphasized that changing the radial and tangential direction of the compositional gradient exponents of FGCP subjected to heat flux along the outer edge significantly influences the strain and stress distributions.