Numerical simulation of Zn coating solidification

Abstract

A numerical model, which simulates nucleation and growth of Zn grains, has been developed in order to describe quantitatively the solidification of Zn coatings during the hot-dipping process. The inputs of the model are the nucleation distribution, which has been measured by electron backscattered diffraction (EBSD), and the dendritic growth kinetics, calculated with an analytical model of a parabolic dendrite tip modified to account for the interactions with the coating interfaces. The model predicts the shapes of the grain envelopes as a function of the grain orientation and the texture induced by growth. Three types of grain envelopes have been evidenced, depending on the angle between the c-axis and the normal to the coating plane. Moreover, it has been shown that growth reinforces the already existing {00.1} nucleation texture, in good agreement with experimental data. The model also predicts the cooling curve, including recalescence, and the grain size. Thus, it is used to describe the effects of Pb additions on solidification. In particular, it has been shown that Pb increases the nucleation undercooling and strongly decreases the density of active nuclei, thus resulting in a much larger grain size.