Numerical simulation of thermal stress during the steady rotation in the growth of ADP crystals by solution circulating method

Abstract

Transient numerical simulations were carried out to describe the temperature and thermal stress in ADP crystals during the steady rotation by solution circulating method (SCM). In a related paper (J. Crystal Growth 574 (2021) 126343), the effects of flow and heat transfer on the distribution of the supersaturation on the crystal face was discussed. This paper presents the corresponding results concerning the heat transfer occurring in the crystal. Emphasis is placed on studying the temperature and thermal stress distribution, since it is critically involved in the processes of crystal cracking. The evolution of the temperature and thermal stress in the crystal are studied as a function of crystal rotation rate, inlet velocity, and inlet temperature and crystal size. The numerical results seem to indicate that, as the rotation rate increases, the value of the σmax in crystal decreases and then increases, while the values of the σmax on crystal surface is increased. The increases of the inlet velocity and the inlet temperature lead to the increase of the σmax. Finally, As the crystal size gets large, the possibility of cracking arising in pyramidal zone is increased obviously.