Numerical Simulation of Optimizing Plating Uniformity of Interconnect Circuits on Printed Circuit Boards

Abstract

Based on the finite element method, the interconnection circuit models with different pattern designs were established and plating copper circuits were simulated to obtain the plating uniformity. Meanwhile, the influence of insulating shield, auxiliary cathode and the distance between anode and cathode (DAC) on the plating uniformity is studied to provide theoretical guidance for improving the uniformity of electroplating copper at actual production. Compared with other pattern designs, the circuit with a pattern design area ratio of 20% has the best plating uniformity under the initial conditions. The increase in the auxiliary cathode width and the decrease the aperture of insulating shield and DAC can improve the electroplating uniformity of circuit.