Year-end Sale % OFF 
Abstract
The heat transfer in heat sinks of microelectronic components has been numerically analyzed for different heat sink geometries in tandem and staggered arrangements. The present numerical study addresses cooling of fins with forced air convection in single micro channel heat sink using Ansys FLUENT software. Maximum heat transfer flux with minimum flow resistance was considered as the selection criteria for different heat sinks. Standard and staggered fins of uniform thickness are considered for all the heat sinks to analyze heat transfer performance. Quality factors corresponding to different geometries were calculated and compared with experimental and numerical results available in open literature. The present numerical results ensure the better performance of staggered heat sinks over standard ones. It has been noticed that staggered fins with conic section provide enhanced quality factors at flow Reynolds number range of 450–900 whereas staggered fins with rounded leading edges provide better thermal performances for Reynolds number beyond 900.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
