Abstract

Fin-plate radiators are actively used in cooling systems for microelectronic devices. Radiators often become dusty during operation, which leads to decrease in heat flow and heat dissipation. Consequently, the possibility of device overheating and failure increases. We carried out numerical studies to assess the influence of the radiator geometry on the deposition of dust particles and, as a consequence, the change in heat flow. We built 3D models of plate radiators with different types of fins (flat and corrugated) and the distance between them. The problem of air flow with dust particles flowing around the radiator has been solved. We revealed the dependences of the efficiency of particle deposition and changes in heat flow on the geometry of the radiator, the size of dust particles and the distance between the fins.

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