Numerical Prediction of Influence Matrix and Filler Properties on Thermal Conductivity of Copper Filled TCA

Abstract

The current paper focuses on the numerical simulation of influence matrix and filler properties on thermal conductivity of thermally conductive adhesives (TCA). The two different epoxy resins which are commonly used as a matrix for TCA were considered. The difference in the viscoelastic properties as well as in the cure shrinkage were taken into account in numerical simulation. The mechanical properties such as elasticity and plasticity of filler has also been taken into account. The paper deals with the numerical simulation of stresses relaxation and changes in contact area between filler particles depending on the matrix and filler properties. Finally, numerically obtained data were confronted with experimental measurements results.