Abstract
To evaluate the reliability of metal-carbon eutectic systems as fixed points for the next generation of the international temperature scale, the effect of the eutectic microstructure on the temperature at the solid/liquid (s/l) interface during solidification and melting is preliminarily investigated using a multi-phase-field model. First, the effects of furnace temperature, lamellar spacing, and interface energy on the average temperature of the s/l interface are studied in the solidification process. With increased furnace undercooling, the s/l interface temperature was found to decrease. Calculated eutectic microstructures are then adopted as initial conditions for a melting simulation. The interface undercooling during melting is observed to be smaller than that observed during solidification. This difference in interface undercooling is attributed to the solute/solvent concentration profiles in the liquid phase near the s/l interface being different for melting and solidification.
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