Numerical models of delamination behavior in 2G HTS tapes under transverse tension and peel

Abstract

In extreme operating environments, delamination in 2G HTS tapes occurs within and/or near the superconductor layer from high transverse tensile stresses caused by fabrication, Lorentz forces and thermal mismatch, etc. Generally, transverse opening and peeling off are the main delamination modes, and are always studied in anvil and peel tests, respectively. Numerical models of these modes for 2G HTS tape are presented wherein the mixed-mode traction-separation law at the interface of the silver and superconductor layers is considered. Plastic deformations of copper, silver, and Hastelloy® in the HTS tape are taken into account. The results obtained from the transverse opening model show that the maximum average tensile stress is smaller than the delamination tensile strength because delamination is asynchronous in the tape. When a crack appears in the tape, only a small stress ( ≤ 1 MPa) is required to expand the crack to other stress free areas through peeling. Using the peeling model, the dependency of the peel strength on peeling angle is investigated under constant fracture toughness. Peel strength decreases with the peeling angle until the minimum value is reached at 150°, and thereafter increases slightly. Other results indicate that peel strength depends strongly on delamination strength, fracture toughness, and thickness of copper layer. The fracture toughness of the delamination interface, which is difficult to obtain by experiment, can be extracted using the present model.