Abstract
Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packaging polymer, the equilibrium moduli are modeled with a model based on scaling analysis and the relaxation behavior of the transient part is described by the cure-dependent relaxation amplitude and reduced relaxation times which are based on the time-conversion superposition principle. The cure-dependent parameters are characterized by using an integrated approach of dynamical mechanical analysis (DMA) and differential scanning calorimetry (DSC) measurements. Finite element modeling is carried out for three configurations of a carrier package map mould and the warpage induced during the curing process and cooling down is predicted. The results show that warpage induced during the curing process has significant contribution on the total warpage of the map.
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