Abstract

Surface layer modification methods using concentrated energy sources to ensure high heating rates of approximately 104 – 105 °C/s are becoming increasingly common in an attempt to improve operational performance of machine components. As a result, it is quite difficult to determine heat cycle parameters by means of experiments to predict the required intensity and distribution behavior of residual stresses and strains. The paper addresses the issue of numerical simulation of the stress-strain behavior during high energy heating by high frequency currents (HFC HEH). A finite element model has been generated using the ANSYS and SYSWELD software based on numerical computations of differential equations for transient heat conduction (Fourier equation), carbon diffusion (Fick's second law), and the elastic-plastic behavior of the material. The simulation data was verified by full-scale experiments using optical and scanning microscopy and mechanical and X-ray methods to determine residual stresses. It has been established that the level of residual compressive stresses on the component surface can be from-500 to-1000 MPa within the range of HFC HEH process variations under review. It is proven in theory and confirmed by experiments that the transition layer thickness must amount to 25 – 33 % of the hardened layer depth for the tensile stress peak to shift to deeper material layers while compressive stresses on the surface decrease by 6 – 10 %, in order to prevent hardening cracks.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.