Numerical Investigation on the Influence of Substrate Board Thermal Conductivity on Electronic Component Temperature Regulation

Abstract

This study presents a detailed numerical analysis of substrate boards made from various materials (FR-4, Si cladding, and Cu cladding) with nine electronic components mounted on them. Each component is subjected to different heat fluxes, and the analysis covers both natural convection (NC) and forced convection (FC) modes of heat transfer at air velocities of 4m/s and 6m/s. The findings reveal that at an air velocity of 6m/s, using a copper cladding board significantly lowers the temperatures of the electronic components by 340C to 540C compared to FR-4 and Si cladding boards. Additionally, the copper cladding reduces the required air-cooling velocity by 2m/s and achieves a temperature reduction for the IC chips ranging from 3.500C to 13.120C. It is recommended to use an air velocity of 4m/s with copper cladding to minimize fan power consumption while maintaining component temperatures below 1250C. These results provide crucial insights for thermal design engineers, aiding in the selection of appropriate substrate boards for effective thermal management of electronic components. The study emphasizes the benefits of copper cladding in distributing heat more uniformly, reducing energy consumption, and maintaining optimal operating temperatures. Furthermore, it suggests that placing high heat-dissipating components at inlet or outlet points can minimize thermal interactions and overall configuration temperatures. The research offers valuable guidance to the heat transfer community, particularly electronic thermal designers, by highlighting the importance of substrate material choice and component placement in enhancing the reliability and lifespan of integrated circuits (ICs). The comprehensive analysis and recommendations serve as a vital resource for optimizing thermal control strategies in electronic devices, ultimately contributing to improved performance and durability.