Numerical investigation of heat transfer mechanism in an embedded PCM-TEG for better overall performance under the fluctuating heat source

Abstract

Using phase change materials (PCM) can effectively ensure the stable operation of semiconductor thermoelectric generators (TEGs). Conventional PCM-TEG structures exhibit relatively poor output performance due to energy barriers caused by low thermal conductivity. The embedded PCM-TEGs proposed in this study can address this issue well by adopting variable structure composite forms of PCM and TEG, resulting in a more complex heat transfer mode than traditional systems. To evaluate embedded systems' characteristics and performance enhancement methods, this paper first establishes a multiphysics mathematical model for embedded PCM-TEGs. Then, employing the TOPSIS method, an optimal embedded structure that considers system output and stability is obtained. Finally, we investigate the effects of key parameters on system performance, including PCM volume, latent heat, melting point, and metal-added composite materials. The CCC PCM-TEG (embedded PCM-TEG with PCM closer to the cold side) exhibits superior performance with a 28.6 % increase compared to conventional structures. For a given PCM volume, embedded structures with equal heights show better performance due to weak influence from asymmetric configurations on internal heat flow direction. Unlike traditional PCM-TEGs, metal-added composite PCMs in embedded structures reduce the temperature difference range across TEGs and thus deteriorate system performance.