Abstract
The present work investigates a numerical simulation of conjugate heat transfer effects inside a computer chassis which is cooled by fans forcing heat convection. The cooling schemes selected for the current study were three, based on the available commercial applications. The temperature distribution on the heat sources and the air pathlines were investigated in order to get a clear picture about which case fully satisfies the operating conditions. The simulation was conducted by the commercial CFD software (FLUENT). The solution is based on the Navier-Stokes equations applying into a three dimensional model. The turbulence model used in this paper was well validated by corresponding experimental data consisting mainly of velocity profiles and temperature distribution provided in the literature review. The study introduced ways that could be beneficial, when cooling of electronic components is needed. In addition, through CFD process, the problematic areas are revealed in order to consider improvements.
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