Abstract

Evaporation and explosive boiling of ultra-thin liquid film are of great significant fundamental importance for both science and engineering applications. The evaporation and explosive boiling of ultra-thin liquid film absorbed on an aluminum nanostructure solid wall are investigated by means of molecular dynamics simulations. The simulated system consists of three regions: liquid argon, vapor argon, and an aluminum substrate decorated with nanostructures of different heights. Those simulations begin with an initial configuration for the complex liquid-vapor-solid system, followed by an equilibrating system at 90 K, and conclude with two different jump temperatures, including 150 and 310 K which are far beyond the critical temperature. The space and time dependences of temperature, pressure, density number, and net evaporation rate are monitored to investigate the phase transition process on a flat surface with and without nanostructures. The simulation results reveal that the nanostructures are of great help to raise the heat transfer efficiency and that evaporation rate increases with the nanostructures’ height in a certain range.

Highlights

  • Research on phase transition phenomena of thin liquid layer on a solid surface has attracted a great deal of attention over the past several decades because of its diverse practical and science applications, such as energy storage [1,2,3], nanoelectronic cooling, and thermal management of nanoelectronics [4]

  • Case of high superheated temperature For the case of high superheated temperature, the heat source is set to a fixed temperature of 310 K, which is much higher than the critical liquid temperature, so the liquid film will enter into explosive boiling in a certain time period

  • A nanoscale phase transition of ultra-thin liquid argon films on heated walls decorated by nanostructures with different heights has been studied using molecular dynamics simulations

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Summary

Introduction

Research on phase transition phenomena of thin liquid layer on a solid surface has attracted a great deal of attention over the past several decades because of its diverse practical and science applications, such as energy storage [1,2,3], nanoelectronic cooling, and thermal management of nanoelectronics [4]. The difference between heat transfer mechanisms at macroscale and nanoscale is not fully understood despite its general importance because of the complexity of physical mechanisms at nanoscale; evaporation and boiling of ultra-thin liquid film on a solid surface decorated with nanostructures is a significant phenomena and a complex problem in thermal management. In this regard, molecular dynamics (MD) simulation, which has advantages of describing any physical process at atomic level, is an ideal tool to investigate heat and mass transfer problems at micro/ nanoscale, so it is this technique that is used here to examine the evaporation and explosive boiling of liquid argon. Sharma and Debenedetti [9] carried out MD simulations to investigate capillary evaporation rates of water restricted between two hydrophobic surfaces

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