Abstract
A CO2 laser die-cutting system, which does not need die board any more, is a new technique for manufacturing packing box. Two optical paths, the galvanometer scanning system and the flying optical system, are used to satisfy different processing needs. The scanning system is composed of galvanometer scanning mirrors and F-θ lens. And the flying optical system is driven by two servo motors. This paper presents the software and hardware design of the laser die-cutting system, the difference between the two optical paths, as well as the relationship among the cutting speed, thickness of wrapping paper and laser power. The cutting speed and thickness of wrapping paper are linearly increased by the incremental laser power, while the cutting speed is hyperbolically decreased by the incremental thickness of wrapping paper when the laser power is constant. The amount of incision is reduced by 20% and the processing time by 40% when tested by a low power RF CO2 laser die-cutting system using the optimized program. This technique is also used for the reference of other rapid laser processing systems.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.