Abstract

Bimetal pure Al/SiC/Ninanocomposites are a remarkable class of nanocomposite materials with a layered structure comprising pure aluminum, silicon carbide nanoparticles, and nickel. The ingenious design of these nanocomposites aims to synergistically combine the desirable properties of each constituent material, resulting in an exceptional enhancement of mechanical, thermal, and electrical characteristics. This study focused on fabricating 1-mm bimetal pure Al/SiC/Ni nanocomposites using an accumulative roll bonding process. The rolling process was conducted for eight cycles at a controlled temperature of 250 °C. To understand the behavior of the bonding interface between the aluminum/nickel layers, a comprehensive investigation was carried out using finite element simulation techniques. The study specifically delved into the bonding mechanisms between the aluminum and nickel layers, employing simulation and experimental procedures. A series of rigorous tests were conducted to evaluate the resulting nanocomposites comprehensively. These included tensile strength tests, peeling tests, average Vickers micro hardness tests, wear-resistant tests, electrical resistance testing, and scanning electron microscopy analysis. These tests thoroughly examined the evolution of the microstructure and the nanocomposites’ mechanical properties. The obtained results conclusively demonstrate that the supplementary accumulative roll bonding process led to substantial improvements in the nanocomposites’ mechanical properties, wear resistance, and electrical resistance properties. Furthermore, the simulation results indicate that the optimal bonding conditions, characterized by robust interfacial bonding, were achieved at higher cumulative rolling cycles.

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