Abstract
Nanosecond pulsed laser drilling is one of the most common material removal processes. Dual focus laser micro drilling is high aspect ratio micro drilling techniques. Tan et al. (2003) proposed the concept of dual focus with dual frequency femtosecond laser micro drilling on PMMA. An investigation of dual frequency micro drilling with nanosecond pulsed laser on 500 μm silicon wafer has been reported in this paper with mathematical modelling supported with experimental results. Numerical modelling has been done to study the effect of dual frequency drilling with respect to intensity distribution and resultant effect on the focused spot size. Experiments were done with single and dual wavelengths with 532 nm and 1,064 nm at different pulse energies and the results were found in reasonable match with theoretical values.
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