Abstract

In practical semiconductor fabs engineering, in order to reduce the investment cost, low coverage rate of FFUs is usually adopted and the air supply velocity is high, which brings high resistance to the filter mounted at FFU’s outlet. If a higher ceiling coverage and lower air velocity speed are used, the resistance may be significantly reduced and remarkable energy saving benefits can be obtained. In this study, CFD technology was adopted to simulate airflow in a semiconductor fab and air circulation resistance was obtained by theoretical calculation. Four ceiling coverage of FFUs, 25%, 50%, 75%, 100%, were studied under the condition of same air volume. The particle concentrations and payback period were analysed. The results show that (1) with the increase of the coverage rate, the concentration in most areas decreases significantly while only a small increase in the local area around occupant, and the particle concentration still meets the requirement; (2) adopting high coverage rate for transformation, the initial investment of FFUs increases slightly and the operating cost decreases significantly, and the payback period is only 1.1-2.3 years when 25% coverage rate is transformed into 37.5% - 75%.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.