Abstract
Based on the kinematics relation of CTP, the quasi-stable CTP model of mixed lubrication is established in polar coordinates, which includes the average Reynolds equation, average clearance equation, pad deformation equation, asperity contact equation and load balance equation. These model equations are solved by the finite difference method, and the instantaneous 3-D distribution of fluid pressure, contact pressure, and the slurry film thickness are presented. Results show that in a wide area of wafer there is negative fluid pressure, which is believed to be due to the distribution of the slurry film thickness including pad deformation. The effects of applied load, pad velocity and rotation speed on the hydrodynamic pressure, asperity contact pressure, minimum film thickness, as well as pad deformation have been analyzed. This parametric study is helpful to further optimize process variables for good CTP performance.
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