Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs

Abstract

As semiconductor performance improves through advanced package designs, it becomes important to consider both thermal and mechanical properties. Better understanding their relationship enhances system design and optimization. This study has introduced a numerical method that takes into account both thermal and mechanical fluxes to construct thermal and mechanical property maps for practical application in semiconductor engineering. Furthermore, this paper investigated the relationship between the two properties using the constructed property maps in commercially available semiconductor packages. Owing to the complexity of packaging design patterns, a coupled isoparametric mapping and machine learning (ML) method was introduced to investigate their effects. The model then determines and investigates the anisotropic equivalent thermal and mechanical properties of the commercialized semiconductor packages with complex pattern designs, according to the package materials, volume fractions of each material, and design patterns. This approach pursues more sophistication and practicality compared to simplified composite structure property evaluation models. Additionally, all processes in the algorithm are automated based on ML methods, making them practically applicable in the semiconductor industry. The study shows that there is a strong correlation between the thermal and mechanical characteristics in the complex package patterns. This relationship was able to form a fairly clear category based on the shape of the dielectric band because the dielectric band had significantly different effects on the thermal and mechanical fluxes. The study discussed the physical implications of the similarities and differences between the two behaviors and validated the results of the equivalent properties through finite element (FE) analysis. Finally, the study cross-validates the relationship by showing that information from one flux behavior can be used to predict the other based on the ML method. Based on the results, this paper can provide a better understanding of thermal and mechanical fluxes in semiconductor package patterns for package design and optimization.