Abstract
The reaction forces at the tungsten support probes of a platinum microwire are determined by numerical analysis for different push-pull sliding velocities and contact pressures. The Finite Element Analysis (FEA) tool ANSYS Workbench is used to evaluate the contact stresses, reaction forces and deformations of the platinum microwire. The nonlinear contact analysis and contact formulations are implemented to ensure that the platinum microwire maintained contact with the tungsten support probes during push-pull sliding motion, and transfer frictional forces between contact surfaces without penetration and separation. The reaction forces at the support probes are found independent of the sliding velocity of the platinum microwire and vary with normal contact pressure. The results found in the numerical analysis are validated through experimental works. Due to the tiny size, the nonlinearity of contacts and indeterminate supports criteria, it is difficult to determine the reaction forces at the supports of a sliding microwire by conventional mechanics. The method of the numerical analysis of the sliding microwire presented in this paper can be used to determine the reaction forces of other microstructures, validate the experimental results, as well as to evaluate total disturbance forces in the microstructures where relative motion exists; which are important for the proper design and failure analysis of the MEMS devices and microstructures.
Highlights
The Mechanical Systems (MEMS) (Micro-Electro-Mechanical-System) technology uses various types of microstructures to build tiny sensors, micro-actuators, micro-valves and devices [1, 2] and their size varies from 1-100 μm [3]
The reaction forces at the support probes of the sliding microwire remain independent of the sliding velocity for constant contact pressure
The procedure and method of the numerical analysis presented in this paper can be used to determine the contact behavior and reaction forces at the supports of other microstructures where relative motion exists
Summary
The MEMS (Micro-Electro-Mechanical-System) technology uses various types of microstructures to build tiny sensors, micro-actuators, micro-valves and devices [1, 2] and their size varies from 1-100 μm [3]. The mechanical behavior of the microstructures in combined with the mechanical load, frictional effect, and the size scale make significant challenges to the analysis of microstructures and MEMS devices [17]. These challenges are possible to overcome by using Finite Element Analysis (FEA) tools such as ANSYS, IDEAS, ABAQUS, COSMOS, etc. The fatigue life, reliability, performance and response of the MEMS devices depend on the contact forces, as well as the mechanical behavior of microstructures [3]. Without finding the reaction or contact forces between the microstructures and supports [6], the proper design and evaluation of the performance of MEMS devices and sensors are not possible [3, 9]. Mohd Tobi, "Prediction of residual stress using explicit finite element method," Journal of Mechanical Engineering and Sciences, vol 9, pp. 1556-1570, 2015
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