Abstract
A thermal via has been used to enhance the heat transfer through the printed circuit board (PCB). Because the thermal conductivity of a dielectric material is very low, the array of metal vias is placed to make thermal paths in the PCB. This paper describes the numerical analysis of the PCB having metal vias and focuses on the heat transfer characteristics under the nonisothermal boundary conditions. The mathematical model of the PCB has the metal vias between two metal sheets. Under 2nd and 3rd kinds of boundary conditions, the temperature distribution is obtained numerically by changing the design parameters. The discussion is also made on the effective thermal conductivity of the PCB. In industry, the use of effective thermal conductivity is convenient for thermal engineers because it simplifies the calculation process, that is, the composite board can be modeled as a homogeneous medium. From the numerical results, it is confirmed that the placement of metal sheets and the population of metal vias are important factors to dominate the heat transfer characteristics of the PCB. It is also shown that although the nonisothermal boundary conditions are applied at the boundary surface, the temperature difference between the heated and the cooled section is almost uniform when the metal vias are populated densely with the metal sheets. In this case, the effective thermal conductivity of the PCB is found to be the same irrespective of the boundary conditions, that is, whether the isothermal or the nonisothermal boundary conditions are applied.
Highlights
Because of an increase in heat dissipation from electronics components placed on a printed circuit board (PCB), a thermal via has been used as one of the thermal solutions to enhance the heat transfer through the PCB
From the above numerical results under Equations (2), (3) and Equations (4), (5), it is confirmed that the placement of metal sheets and the population of metal vias are important factors to dominate the temperature distribution of the model
Numerical analysis is conducted on the heat transfer characteristics of the PCB, where the metal vias are placed between the metal sheets
Summary
Because of an increase in heat dissipation from electronics components placed on a printed circuit board (PCB), a thermal via has been used as one of the thermal solutions to enhance the heat transfer through the PCB. The thermal via is a small hollow cylinder of copper, and their arrays are placed inside the board. The thermal conductivity of the metal via is about 1000 times higher than that of a dielectric material, and the via serves effectively as a heat conduction path through the board. Many studies have been published on the heat transfer characteristics of thermal vias. Nakayama [2] conducted a detailed analysis on the heat conduction in the PCB. This study dealt with a substrate for a ball grid array package, where a belt of densely populated through-vias and two continuous copper layers were placed. One-dimensional heat flow inside the PCB was assumed, and a calculation model was presented based on a thermal resistance network. Hatakeyama et al [4] showed a two-dimensional thermal resistance network model of the thermal via. Bissuel et al [7] showed the effectiveness of micro-via structures in the PCB
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