Numerical analysis of micro-channel heat sink using ethylene glycol based nanofluid in case of electronics cooling

Abstract

As size of Integrated circuit is goes on decreasing and number of elements per chip increases, the heat dissipation per unit area of IC increases. Therefore, nanofluid forced convection cooling using an micro-channel heat sink is introduced as new research topic for efficient cooling of IC devices. In this manuscript, ethylene glycol base nanofluid has been studied by using five different oxide nanoparticles including Al2O3, TiO2, CuO, SiO2 and ZnO and varying their concentration from 0 to 10% volume fraction. Single phase model has been considered in simulation analysis using ANSYS Fluent 13.0 software and the results obtained from simulation have been validated with previous experimental and simulation work. Furthermore, several aspects of parameters such as local thermal resistance, pumping power and local heat transfer coefficient are presented in below manuscript. From the result it is analysed that ethylene glycol base nanofluid increases the heat transfer parameters very effectively. Further, as concentration of nanoparticle sis increases the convective heat transfer coefficient and pumping power increases. Also, CuO-EG nanofluid cooled electronics devices more efficiently compared to other nanofluid which are considered in this study.