Abstract
Heat sinks absorb thermal energy from devices which operates at higher temperatures and dissipates to surrounding medium. Overheating of electronic components can reduce the efficiency, reliability and life of energy systems. The focus of most of the researchers is on the improvement of the performance of the heat sinks. The performance of the heat sinks can be enhanced by incorporation of the phase change materials (PCM). In the present work, a novel design of PCM-based finned heat sink is modeled numerically using ANSYS FLUENT. Holes are drilled along the fins and filled with PCM to improve the heat storage capacity of the heat sink. PCM-based heat sinks with high heat dissipating qualities are well suitable for electronic cooling application. In this study, thermal resistance is calculated to analyze the performance of the heat sink. The performance of the PCM-based heat sink is evaluated for various PCM and composite PCMs and compared with the heat sink without PCM.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
