Abstract

Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the plating works smoothly. Since the bubbles are generated randomly and everywhere, a volume-averaged, two-phase, two-velocity, one pressure-flow model is applied. This fluid system is coupled with a set of convection–diffusion equations for the chemicals subject to flux boundary conditions for electron balance. The moving boundary due to plating is considered. The Galerkin-characteristic finite element method is used for temporal and spatial discretizations; the well-posedness of the numerical scheme is proved. Numerical studies in two dimensions are performed to validate the model against earlier one-dimensional models and a dedicated experiment that has been set up to visualize the distribution of bubbles.

Highlights

  • The numerical simulation predicts that most bubbles are generated at an early stage and near the inlet

  • The numerical simulation of electroless plating is difficult for two reasons: multi-phase modeling and nonlinearities

  • The nonlinearities being similar to those of the Navier–Stokes equations, we have used a semi-Eulerian time discretization leading to a generalized Stokes operator for the two-velocity/one-pressure system; the inf-sup saddle point theorem has lead to a proof of stability and well-posedness of the discretized system by the Hood–Taylor finite element method

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Summary

Introduction

Electroless plating is an industrial chemical process aimed at forming a thin film or layer on a base substrate by reducing complex metal cations in a liquid solution [1,2,3]. This technique has been widely applied in various industries. There are several works on the simulation of electroless processes that study the convection or migration of chemical species under a single-phase flow (e.g., [8,9]). For the simulation, we chose a system that includes a gas–liquid two-phase flow, chemical species transport, surface reaction, and moving boundary due to deposition.

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