Abstract

AbstractIn order to obtain a large Si grain and to control the location of grain boundary in a Si film thermally melting-crystallized by pulse laser, we have proposed to use a periodic thermal distribution spontaneously induced by a linearly polarized laser beam. The lateral grain growth of polycrystalline Si thin films, which is controlled by the laser-induced periodic thermal distribution, was analyzed numerically by two-dimensional finite element computer simulations. From this analysis, it can be conclude that the laser irradiation should be performed to melt not all but most of Si film or melt it partially, making the large difference between the maximal and minimal temperature in the thermal distribution. It was also found that the temperature difference was increased with the optical absorption in the Si film and the fluence.

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