Abstract
AbstractThis year some twenty billion integrated circuits will be produced worldwide. Almost all (98%) of them will be made with a photosensitive varnish, the photo resist, that allows the transfer of a fine line‐pattern from an original transparency onto a silicon wafer. This photoresist has two components: one is a novolak resin, a low molecular weight phenol–formaldehyde condensation polymer; the other is a diazonaphthoquinone derivative (DNQ), which is the photoactive part of the system. Novolak–diazoquinone resists have played a crucial role in the microminiaturization of electronics. They are photographic materials of extremely high resolution, able to define features as small as 0.25 μm. Although they are now an indispensible ingredient of modern computer technology, until quite recently their molecular mechanism was not understood. We report here on work at Polytechnic University in New York aimed at solving the mystery of these important and intriguing systems. The solution, in so far as it has revealed itself to us, is rather unique and quite unexpected.
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