Abstract
AbstractNovolak resins have been optimized for high performance positive photoresists. Low molecular weight novolak resins are the key components for improving resolution capability, sensitivity, and heat resistance of positive photoresists. Various phenolic compounds (monomers) and oligomers of metacresol novolak resins were evaluated as low molecular weight components. It was found that phenolic compounds that have moderate hydrophobicity and azocoupling capability with diazonaphthaoquinone compounds greatly improve positive photoresist performance. This is explained in terms of the Stone wall model for positive photoresist development.
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