Abstract
Microfluidic application of surface acoustic wave (SAW) devices require a fluid compatible technology approach, high power durability of the electrode material, and long lifetime of the devices. However, conventional approaches for SAW devices using electrodes exposed on the chip surface can be hardly applied to microfluidics due to incompatibility with the applied fluid, high surface topography, low acoustomigration resistance, or thermally caused frequency shift. The present paper describes two novel modular technology approaches for SAW based microfluidic devices with interdigital transducer electrodes buried in acoustically suited SiO2 and chemical-mechanically polished surfaces. Two promising technological approaches will be demonstrated in our paper using Al- as well as Cu-based thin film electrodes on 128° YX-LiNbO3 substrates.
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