Abstract
A novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors describing the skin effect are taken into account through Green’s function. The equivalent surface impedance model can be used to simplify electromagnetic simulation only using electric field integral equation. Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which is suited for modeling of 3-D interconnects and integrated passive structures.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
