Abstract
Dianhydride (3′, 4, 4′-biphenyltetracarboxylic dianhydride (BPDA) and Diamine (p-phenylediamine (PDA) in a ratio of 1:1 polymerize Polyimide (PI) in N-Methyl-2-Pyrrolidone (NMP) as solvent. A series of PI films were made in presence of BPDA and two types of Diamines (PDA and HAB (4, 4′-Diamino-3, 3′-dihydroxybiphenyl) where Diamines ratios were 95:5, 90:10, 80:20, 50:50, 0:100. HAB was introduced as source of benzoxazole. Fourier transform infrared (FTIR) confirmed that there was benzoxazole ring in polyimide after curing. FTIR, Differential scanning calorimetry (DSC), UV-spectrophotometer, Scanning electronic microscope (SEM), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and stress-strain tests were used to measure the performance of the films. The results indicated that small content of benzoxazole (5%) increase thermal stability, glass transition temperature and tensile strength prominently than the pristine PI which may use for microelectronics.
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