Abstract
Novel plasmaless photoresist removal method in gas phase at room temperature has been developed using pure ozone gas which has nearly 100% of concentration. This method has enabled the removal of high dose ion implanted photoresist that had been difficult to remove so far. Conventionally, the temperature rise of 200{degree sign}C or more was necessary in the photoresist removal with the ozone gas to achieve an enough effect. Because the strong reactiveness is due to the oxygen radical generated when the ozone molecules decomposed. However, Popping by the temperature rise becomes a problem in the removal of high dose ion implanted photoresist. Then, in this experiment, ethylene gas was used to control the decomposition of ozone molecule at the room temperature. As a result, it was confirmed that the ashing using ethylene gas and ozone gas was effective to remove the high dose ion implanted photoresist under unheating condition.
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