Abstract
A novel wet vapor photoresist stripping technology is developed as an alternative to dry plasma ashing and wet stripping. Experiments using this technology to strip hard baked SU-8 photoresist, aurum and chromium film are carried out. Then the images of stripping results are shown and the mechanism is analyzed and discussed. The most striking result of this experiment is that the spraying mixture of steam and water droplets can strip photoresist and even metal film with ease.
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