Novel Package Technology of Ultra High Power Light-Emitting Diodes by Electroplating

Abstract

Thermal management of devices package is now a critical problem for applications of high power light emitting diodes (LEDs). In this paper coppers were first electroplated on the novel package red, green, and blue LED chips directly. With the copper plating layer, the endurable injection current of these LED chips can be increased easily from conventional 350 mA to more than 1680 mA in room temperature; especially the input power of the GaN-based single chip blue LED can be increased to 12W. The relative luminous intensity at 350 mA of the novel red, green, and blue LEDs (RGB LEDs) have 53%, 69%, and 23% enhancement respectively compared with those of the conventional packaged LEDs. When the injection current of these LED chips were increased to 850mA , the relative luminous intensity of the novel RGB LEDs chips have 431% and 83%, and 18% enhancement respectively compared with those of the conventional packaged ones.