Abstract
In this contribution a concept of ceramic transmitter and receiver module for assembly on electro-optical printed circuit board with parallel optical interconnects is presented. The realized pitch of parallel optical interconnection amounts to 250 mum. The solution for realization of the indirect optical coupling basing on micro-optical coupling element will be shown. Described optical analysis in regard to the optical coupling between link components (VCSEL, micro-optical coupling elements and p-i-n-photodiode array) will define the conditions for alignment process of optoelectronic devices and micro-optics. The design and realization of an optical multi-chip module basing on ceramic interposer will be presented in detail. An approach for the flux free solder-bumped flip chip assembly process of optoelectronic components will be shown. Finally the first demonstrator of the optical transmitter and receiver module will be demonstrated.
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